Slim Water Injection Nozzle for Silicon Wafer Wet Cleaning Bath

The Evolution of Silicon Wafer Cleaning Technology

The purity of wafer surfaces is an essential requisite for the successful fabrication of VLSI and ULSI silicon circuits. Wafer cleaning chemistry has remained essentially unchanged in the past 25 years and is based on hot alkaline and acidic hydrogen peroxide solutions, a process known as "RCA Standard Clean." This is still the primary method used in the industry. What has changed is its implem...

Wet-Chemical Etching and Cleaning of Silicon

A Introduction Research and manufacturing related to silicon devices, circuits, and systems often relies on the wet-chemical etching of silicon wafers. The dissolution of silicon using liquid solutions is needed for deep etching and micromachining, shaping, and cleaning. Also, wet-chemistries are often used for defect delineation in single crystal silicon materials. In this paper, a review of t...

Wafer Cleaning: Wet Methods Still Lead the Pack

As feature sizes continue their frantic descent into the sub-0.6 pm region, wafer cleaning is on its way toward becoming a true enabling technology. Ridding wafers of the i r process chemicals is one of the most common steps in fabrication. It’s also, often a dirty one, in terms of picking up contaminants. The heavy metals, alkali metals and light elements, all common to wafer processing, also ...

Trends in Wafer Cleaning

Hydrophobic silicon wafer bonding

Wafers prepared by an HF dip without a subsequent water rinse were bonded at room temperature and annealed at temperatures up to 1100 “C. Based on substantial differences between bonded hydrophilic and hydrophobic Si wafer pairs in the changes of the interface energy with respect to temperature, secondary ion mass spectrometry (SIMS) and transmission electron microscopy (TEM), we suggest that h...